NXP Semiconductors
BT151-500RT
SCR
7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
p
q
D
1
A
A
1
mounting
base
D
L
1(1)
b
1(2)
(3×)
b
2(2)
(2×)
1
2
3
L
2(1)
Q
L
b(3×)
e
e
c
0
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
4.7
4.1
A
1
1.40
1.25
b
0.9
0.6
b
1(2)
1.6
1.0
b
2(2)
1.3
1.0
c
0.7
0.4
D
16.0
15.2
D
1
6.6
5.9
E
10.3
9.7
5
scale
10 mm
e
2.54
L
15.0
12.8
L
1(1)
3.30
2.79
L
2(1)
max.
3.0
p
3.8
3.5
q
3.0
2.7
Q
2.6
2.2
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
OUTLINE
VERSION
SOT78
REFERENCES
IEC
JEDEC
3-lead TO-220AB
JEITA
SC-46
EUROPEAN
PROJECTION
ISSUE DATE
08-04-23
08-06-13
Fig. 12. TO-220AB (SOT78)
BT151-500RT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
27 July 2012
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