NXP Semiconductors
BT138-600E
4Q Triac
9. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
1.5
2
Unit
K/W
K/W
Rth(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6
half cycle; Fig. 6
-
-
-
-
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
-
60
-
K/W
003aaj343
10
Z
th(j-mb)
(K/W)
1
(1)
(2)
-1
-2
-3
10
10
10
P
D
t
t
p
-5
-4
-3
-2
-1
10
10
10
10
10
1
10
t
p
(s)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BT138-600E
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Product data sheet
30 August 2013
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