NXP Semiconductors
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
10. Soldering
3.3
2.9
1.9
solder lands
solder resist
3
1.7
2
solder paste
0.6
(3×)
occupied area
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
0.7
(3×)
Fig 19. Reflow soldering footprint for SOT23 (TO-236AB)
2.2
1.2
(2×)
1.4
(2×)
solder lands
4.6
2.6
solder resist
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 20. Wave soldering footprint for SOT23 (TO-236AB)
BSS138BK
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 4 August 2011
12 of 16
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