NXP Semiconductors
74HC32; 74HCT32
Quad 2-input OR gate
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC32N
74HCT32N
74HC32D
74HCT32D
74HC32DB
74HCT32DB
74HC32PW
74HCT32PW
74HC32BQ
74HCT32BQ
40 C
to +125
C
DHVQFN14
40 C
to +125
C
TSSOP14
40 C
to +125
C
SSOP14
40 C
to +125
C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT108-1
SOT337-1
SOT402-1
40 C
to +125
C
Name
DIP14
Description
plastic dual in-line package; 14 leads (300 mil)
Version
SOT27-1
Type number
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm
4. Functional diagram
1
2
≥1
3
4
1
2
4
5
9
10
12
13
1A
1B
2A
2B
3A
3B
4A
4B
1Y
3
5
≥1
6
2Y
6
9
10
≥1
8
3Y
8
A
12
13
4Y
11
≥1
11
B
Y
mna241
mna242
mna243
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram (one gate)
74HC_HCT32
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 4 September 2012
2 of 17
PHILIPS [ NXP SEMICONDUCTORS ]
