NXP Semiconductors
74HC32; 74HCT32
Quad 2-input OR gate
12. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D
seating plane
M
E
A
2
A
L
A
1
c
Z
e
b
1
b
14
8
M
H
w
M
(e
1
)
pin 1 index
E
1
7
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.2
0.17
A
1
min.
0.51
0.02
A
2
max.
3.2
0.13
b
1.73
1.13
0.068
0.044
b
1
0.53
0.38
0.021
0.015
c
0.36
0.23
0.014
0.009
D
(1)
19.50
18.55
0.77
0.73
E
(1)
6.48
6.20
0.26
0.24
e
2.54
0.1
e
1
7.62
0.3
L
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
M
H
10.0
8.3
0.39
0.33
w
0.254
0.01
Z
(1)
max.
2.2
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
REFERENCES
IEC
050G04
JEDEC
MO-001
JEITA
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 8.
74HC_HCT32
Package outline SOT27-1 (DIP14)
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 4 September 2012
9 of 17
PHILIPS [ NXP SEMICONDUCTORS ]
