NXP Semiconductors
74HC04-Q100; 74HCT04-Q100
Hex inverter
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
E
v
M
A
Z
14
8
Q
A
2
pin 1 index
θ
L
p
L
1
7
A
1
(A
3
)
A
detail X
w
M
e
b
p
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
2
A
1
0.21
0.05
A
2
1.80
1.65
A
3
0.25
b
p
0.38
0.25
c
0.20
0.09
D
(1)
6.4
6.0
E
(1)
5.4
5.2
e
0.65
H
E
7.9
7.6
L
1.25
L
p
1.03
0.63
Q
0.9
0.7
v
0.2
w
0.13
y
0.1
Z
(1)
1.4
0.9
θ
8
o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT337-1
REFERENCES
IEC
JEDEC
MO-150
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT337-1 (SSOP14)
74HC_HCT04_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 10 April 2013
10 of 16
PHILIPS [ NXP SEMICONDUCTORS ]
