NXP Semiconductors
74HC04-Q100; 74HCT04-Q100
Hex inverter
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
E
v
M
A
Z
14
8
Q
A
2
pin 1 index
A
1
θ
L
p
L
(A
3
)
A
1
e
b
p
7
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
5.1
4.9
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.72
0.38
θ
8
o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
MO-153
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 10. Package outline SOT402-1 (TSSOP14)
74HC_HCT04_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 10 April 2013
11 of 16
PHILIPS [ NXP SEMICONDUCTORS ]
