NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Per device
thermal resistance from
junction to ambient
SOT23
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
SOD323
SOD523
SOD882
SOT323
R
th(j-sp)
thermal resistance from
junction to solder point
SOT363 (BAS70XY)
[1]
[2]
[3]
Thermal characteristics
Parameter
Conditions
in free air
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
500
416
700
416
330
450
450
500
625
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
-
-
260
K/W
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol
Per diode
V
F
forward voltage
I
F
= 1 mA
I
F
= 10 mA
I
F
= 15 mA
I
R
C
d
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
410
750
1
100
10
2
mV
mV
V
nA
μA
pF
reverse current
diode capacitance
Pulse test: t
p
≤
300
μs; δ ≤
0.02.
V
R
= 50 V
V
R
= 70 V
V
R
= 0 V; f = 1 MHz
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
6 of 20
PHILIPS [ NXP SEMICONDUCTORS ]
