BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.75
2.45
2.1
1.6
solder lands
0.4
(6×)
0.3
(2×)
0.25
(2×)
placement area
0.538
0.55
1.075
1.7
2
(2×)
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
17 of 20