BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
occupied area
solder paste
4
3
2
2.70
1.30 3.00
1
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
4
3
1.15 4.00 4.60
solder lands
solder resist
occupied area
1
2
Dimensions in mm
1.00
preferred transport direction during soldering
3.40
msa422
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
15 of 20
NXP [ NXP ]
