BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.60
(2×)
0.40
(2×)
2.35
0.90 2.10
0.50
(4×)
solder paste
solder lands
solder resist
occupied area
0.50
(4×)
1.20
2.40
MSA432
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
2.5
0.3
4.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 26. Wave soldering footprint SOT363 (SC-88)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
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