NXP Semiconductors
1PS76SB10
Schottky barrier single diode
10. Soldering
3.05
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×)
0.6 (2×)
solder paste
occupied area
2.2
0.5
(2×)
0.6
(2×)
Dimensions in mm
sod323_fr
Fig. 5.
Reflow soldering footprint for SOD323 (SOD323)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
2.75
1.2
(2×)
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
Fig. 6.
Wave soldering footprint for SOD323 (SOD323)
11. Revision history
Table 8.
Revision history
Release date
20120718
Data sheet status
Product data sheet
Change notice
-
Supersedes
1PS76SB10 v.2
Data sheet ID
1PS76SB10 v.3
Modifications:
•
•
•
•
•
The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Package outline drawing replaced by minimized package ouline drawing
Section "Test information" added
Section "Soldering" added
Product specification
Product specification
-
-
1PS76SB10 v.1
-
© NXP B.V. 2012. All rights reserved
1PS76SB10 v.2
1PS76SB10 v.1
1PS76SB10
20040126
19961014
All information provided in this document is subject to legal disclaimers.
Product data sheet
18 July 2012
5/8
PHILIPS [ NXP SEMICONDUCTORS ]
