BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.2
0.6
1.1
0.7
2
3
2.0 0.85
1.5
0.5
(3x)
1
0.6
(3x)
msa438
1.9
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
Fig 28. Reflow soldering footprint SOT416
2.75
2.45
2.1
1.6
solder lands
0.4
(6×)
0.3
(2×)
0.25
(2×)
placement area
0.538
0.55
1.075
1.7
2
(2×)
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
18 of 22
NXP [ NXP ]
