BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
1.30
0.30
R = 0.05 (8×)
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder paste
solder resist
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering footprint SOD882
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
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