BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.65
solder lands
0.4 (2×)
1.5
2.35
0.6
0.5
solder resist
(4×)
(4×)
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
sot363_fr
Fig 26. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
solder resist
occupied area
2.5
0.3
4.5
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 27. Wave soldering footprint SOT363 (SC-88)
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
17 of 22
NXP [ NXP ]
