NXP Semiconductors
TDA5051A
Home automation modem
Table 5.
Characteristics
…continued
V
DDD
= V
DDA
= 5 V
±
5 %; T
amb
=
−
40
°
C to +85
°
C; V
DDD
connected to V
DDA
; DGND connected to AGND.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when
using an external clock generator)
V
IH
V
IL
V
OH
V
OL
Clock
f
osc
f
osc
/f
cr
f
osc
/f
CLKOUT
oscillator frequency
ratio between oscillator and
carrier frequency
ratio between oscillator and
clock output frequency
carrier frequency
set-up time of the shaped
burst
hold time of the shaped
burst
minimum pulse width of
DATA_IN signal
output carrier signal
(RMS value)
power amplifier maximum
output current (peak value)
output impedance of the
power amplifier
output DC level at
pin TX_OUT
total harmonic distortion on
CISPR16 load with the
coupling network (measured
on the first ten harmonics)
V
o(rms)
= 121 dBμV on
CISPR16 load;
f
osc
= 8.48 MHz;
DATA_IN = LOW
(no modulation);
see
Figure 3
and
Figure 22
V
o(rms)
f
osc
= 8.48 MHz;
DATA_IN = 300 Hz;
duty factor = 50 %;
see
Figure 4
f
osc
= 8.48 MHz
f
osc
= 8.48 MHz;
see
Figure 8
f
osc
= 8.48 MHz;
see
f
osc
= 8.48 MHz;
see
DATA_IN = LOW;
Z
L
= CISPR16
DATA_IN = LOW;
Z
L
= 1
Ω
[2]
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
LOW-level output voltage
I
OH
=
−1.6
mA
I
OL
= 1.6 mA
0.7V
DD
−0.5
2.4
-
6.080
-
-
-
-
-
-
-
64
2
V
DD
+ 0.5
0.2V
DD
−
0.1
-
0.45
9.504
-
-
V
V
V
V
MHz
Transmission mode
f
cr
t
su
t
h
t
W(DI)(min)
V
o(rms)
I
o(max)
Z
o
V
O
THD
-
-
-
-
120
-
-
-
-
132.5
170
170
190
-
160
5
2.5
−55
-
-
-
-
122
-
-
-
-
kHz
μs
μs
μs
dBμV
mA
Ω
V
dB
B
−20dB
bandwidth of the shaped
output signal (at
−20
dB)
on CISPR16 load with the
coupling network
-
3000
-
Hz
TDA5051A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 13 January 2011
8 of 29
PHILIPS [ NXP SEMICONDUCTORS ]
