NXP Semiconductors
2PA1774xMB series
40 V, 100 mA PNP general-purpose transistors
11. Soldering
Footprint information for reflow soldering
SOT883B
1.3
0.7
R0.05 (8x)
0.9
0.25
(2x)
0.6
0.7
0.3
(2x)
0.4
(2x)
0.3
0.4
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
sot883b_fr
Reflow soldering is the only recommended soldering method.
Fig 8.
Reflow soldering footprint DFN1006B-3 (SOT883B)
2PA1774XMB_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
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