SURFACE MOUNT DEVICE LED
Part No. : L-C150TBZCT-AG
REV:B / 3
4. Lead-Free Soldering
For Reflow Soldering :
、 ℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、 ℃
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
、 ℃，
3 Peak Temperature:260 5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
、 ℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
、
1 Pre-Heat Temp:150
℃
Max. 120 Sec. Max.
、 ℃
2 Bath Temp:265 Max.
3、Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-72-03-0010
DATE : 2013-5-29
PAGE
13 of 17
PARA-FOR-068
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