Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-SRA-E102R
10－4
Part No.
ERA3
7. Mechanical characteristic
Specifications
Item
Chip Resistor
Explanation
Substrate :
Glass epoxy(t=1.6mm)
Span
: 90mm
Bending distance :3mm (10 seconds)
1.0 1.0 1.0
1
(unit: mm)
Without distinct deforma-
tion in appearance
Bond strength
of the face
plating
± (0.5 % + 0.05Ω)
100
Termination should be
covered uniformly with
solder
(min. 95% coverage)
± (0.5 % + 0.05Ω)
Resistors shall be dipped in the melted sol-
der bath at
235
±
5
°C for
2
±
0.5
sec.
Flux shall be removed from the surface
of termination with clean organic solvent.
Resistors shall be dipped in the melted
solder bath at
270
±
3
°C for
10
±
1
°C sec.
olvent solution : Isopropyl alcohol
Solderability
Resistance to
Soldering Heat
Resistance to
Solvent
Without distinct
deformation in appearance (1)Dipping 10 +/- 1 hours, dry in room
condition for 30 +/- 10 minutes.
± (0.5 % + 0.05Ω)
(2)Ultrasonic wave washing : 5 +/- 1 min.
(0.3W/cm
2
,28kHz)
Dry in room condition for 30 +/-10
minutes.
Panasonic Electronic Devices Co., Ltd.
40
PANASONIC [ PANASONIC SEMICONDUCTOR ]
