Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Part No.
Spec. No.
151-SRA-E102R
E R A 3
10 4
－
7. Mechanical characteristic
Specifications
Chip Resistor
Item
Explanation
: Glass epoxy(t=1.6mm)
Substrate
Span
:
90mm
Bending distance:3mm (10 seconds)
Without distinct deforma-
tion in appearance
1.0 1.0 1.0
(unit: mm)
Bond strength
of the face
plating
± (0.5 % + 0.05Ω)
100
Resistors shall be dipped in the melted sol-
Termination should be
covered uniformly with
solder
der bath at
235 ± 5
°C for
2 ± 0.5
sec.
Solderability
Flux shall be removed from the surface
of termination with clean organic solvent.
Resistors shall be dipped in the melted
solder bath at 270 ± 3°C for 10 ±1°C sec.
(min. 95% coverage)
Resistance to
Soldering Heat
± (0.5 % + 0.05Ω)
Without distinct
olvent solution : Isopropyl alcohol
deformation in appearance
(1)Dipping 10 +/- 1 hours, dry in room
condition for 30 +/- 10 minutes.
Resistance to
Solvent
(2)Ultrasonic wave washing : 5 +/- 1 min.
(0.3W/cm2,28kHz)
± (0.5 % + 0.05Ω)
Dry in room condition for 30 +/-10
minutes.
Panasonic Electronic Devices Co., Ltd.
PANASONIC [ PANASONIC ]
