NE5517, NE5517A, AU5517
B
AMP
BIAS
INPUT
16
B
DIODE
BIAS
15
B
INPUT
(+)
14
B
INPUT
(−)
13
B
OUTPUT
12
B
BUFFER
INPUT
10
B
BUFFER
OUTPUT
9
V+ (1)
11
−
B
+
+
A
−
1
AMP
BIAS
INPUT
A
2
DIODE
BIAS
A
3
INPUT
(+)
A
4
INPUT
(−)
A
5
OUTPUT
A
6
V−
7
BUFFER
INPUT
A
8
BUFFER
OUTPUT
A
NOTE:
V+ of output buffers and amplifiers are internally connected.
Figure 2. Connection Diagram
MAXIMUM RATINGS
Rating
Supply Voltage (Note 1)
Power Dissipation, T
amb
= 25
°C
(Still Air) (Note 2)
NE5517N, NE5517AN
NE5517D, AU5517D
Thermal Resistance, Junction−to−Ambient
D Package
N Package
Differential Input Voltage
Diode Bias Current
Amplifier Bias Current
Output Short-Circuit Duration
Buffer Output Current (Note 3)
Operating Temperature Range
NE5517N, NE5517AN
AU5517T
Operating Junction Temperature
DC Input Voltage
Storage Temperature Range
Lead Soldering Temperature (10 sec max)
Symbol
V
S
P
D
1500
1125
R
qJA
°C/W
140
94
±5.0
2.0
2.0
Indefinite
20
0
°C
to +70
°C
−40
°C
to +125
°C
150
+V
S
to −V
S
−65
°C
to +150
°C
230
°C
°C
mA
°C
V
mA
mA
Value
44 V
DC
or
±22
Unit
V
mW
V
IN
I
D
I
ABC
I
SC
I
OUT
T
amb
T
J
V
DC
T
stg
T
sld
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For selections to a supply voltage above
±22
V, contact factory.
2. The following derating factors should be applied above 25
°C
N package at 10.6 mW/°C
D package at 7.1 mW/°C.
3. Buffer output current should be limited so as to not exceed package dissipation.
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