MMBT2222LT1, MMBT2222ALT1
PACKAGE DIMENSIONS
SOT−23 (TO−236AB)
CASE 318−08
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
A
L
3
1
2
B S
V
G
C
D
H
K
J
INCHES
MILLIMETERS
DIM MIN
MAX
MIN
MAX
A
0.1102 0.1197
2.80
3.04
B
0.0472 0.0551
1.20
1.40
C
0.0350 0.0440
0.89
1.11
D
0.0150 0.0200
0.37
0.50
G
0.0701 0.0807
1.78
2.04
H
0.0005 0.0040 0.013
0.100
J
0.0034 0.0070 0.085
0.177
K
0.0140 0.0285
0.35
0.69
L
0.0350 0.0401
0.89
1.02
S
0.0830 0.1039
2.10
2.64
V
0.0177 0.0236
0.45
0.60
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
ONSEMI [ ON SEMICONDUCTOR ]
