MC44603
Figure 13. Current Sense Gain
versus Temperature
Figure 14. Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
80
5.0
4.0
3.2
3.1
3.0
Printed circuit board heatsink example
2.0 oz
L
Copper
L
3.0 mm
R
60
40
20
0
3.0
2.0
θ
JA
Graphs represent symmetrical layout
V
R
C
= 12 V
= 10 k
= 820 pF
CC
ref
T
2.9
2.8
P
for T = 70°C
A
D(max)
1.0
0
–50
–25
0
25
50
75
100
0
10
20
30
40
50
T , AMBIENT TEMPERATURE (
°C)
L, LENGTH OF COPPER (mm)
A
Figure 15. Propagation Delay Current Sense
Input to Output versus Temperature
Figure 16. Startup Current versus V
CC
140
120
100
80
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
V
R
C
= 12 V
= 10 k
= 820 pF
R
= 10 k
ref
CC
ref
T
C
= 820 pF
T
–50
–25
0
25
50
75
100
0
2.0
4.0
6.0
, SUPPLY VOLTAGE (V)
CC
8.0
10
12
14
T , AMBIENT TEMPERATURE (
°C)
V
A
Figure 17. Supply Current versus
Supply Voltage
Figure 18. Power Supply Zener Voltage
versus Temperature
21.5
16
14
12
10
21.0
20.5
8.0
6.0
4.0
2.0
0
20.0
19.5
19.0
T
= 25°C
A
R
C
V
= 10 k
= 820 pF
= 0 V
ref
T
I
= 25 mA
75
CC
FB
CS
V
= 0 V
2.0
4.0
6.0
V
8.0
10
12
14
16
–50
–25
0
25
50
100
, SUPPLY VOLTAGE (V)
T , AMBIENT TEMPERATURE (
°C)
CC
A
8
MOTOROLA ANALOG IC DEVICE DATA
ONSEMI [ ONSEMI ]
