MC14069UB
PACKAGE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X
K
REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
–––
1.20
–––
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
_
8
_
0
_
8
_
0.10 (0.004)
0.15 (0.006) T U
S
M
T U
S
V
S
N
2X
L/2
14
8
0.25 (0.010)
M
L
PIN 1
IDENT.
1
7
B
–U–
N
F
DETAIL E
K
K1
J J1
0.15 (0.006) T U
S
A
–V–
C
0.10 (0.004)
–T–
SEATING
PLANE
D
G
H
DETAIL E
http://onsemi.com
6
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
SECTION N–N
–W–
ONSEMI [ ON SEMICONDUCTOR ]
