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MC10H166FNR2G 参数 Datasheet PDF下载

MC10H166FNR2G图片预览
型号: MC10H166FNR2G
PDF下载: 下载PDF文件 查看货源
内容描述: 5位幅度比较 [5−Bit Magnitude Comparator]
分类和应用:
文件页数/大小: 8 页 / 155 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MC10H166
5−Bit Magnitude
Comparator
Description
The MC10H166 is a 5−Bit Magnitude Comparator and is a
functional/ pinout duplication of the standard MECL 10K™ part with
100% improvement in propagation delay and no increase in
power−supply current.
The MC10H166 is a high−speed expandable 5−bit comparator for
comparing the magnitude of two binary words. Two outputs are
provided: A < B and A > B. The A = B function can be obtained by
wire−ORing these outputs (a low level indicates A = B) or by
wire−NORing the outputs (a high level indicates A = B). A high level
on the enable function forces both outputs low.
Features
http://onsemi.com
MARKING DIAGRAMS*
16
MC10H166L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
Propagation Delay, Data−to−Output, 2.0 ns Typical
Power Dissipation 440 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K Compatible
Pb−Free Packages are Available*
Inputs
E
H
L
L
L
A
X
B
X
16
16
1
Outputs
PDIP−16
P SUFFIX
CASE 648
1
MC10H166P
AWLYYWWG
TRUTH TABLE
A<B
L
L
L
H
A>B
L
L
H
L
WORD A = WORD B
WORD A > WORD B
WORD A < WORD B
1 20
DIP
PIN ASSIGNMENT
V
CC1
A>B
A<B
B0
A0
A1
B1
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
E
B2
A2
A3
B3
B4
A4
20 1
PLLC−20
FN SUFFIX
CASE 775
10H166G
AWLYYWW
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
March, 2006
Rev. 7
Publication Order Number:
MC10H166/D