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FDC610PZ 参数 Datasheet PDF下载

FDC610PZ图片预览
型号: FDC610PZ
PDF下载: 下载PDF文件 查看货源
内容描述: [P 沟道,PowerTrench® MOSFET,-30V,-4.9A,42mΩ]
分类和应用: 开关光电二极管晶体管
文件页数/大小: 7 页 / 593 K
品牌: ONSEMI [ ONSEMI ]
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Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = –250µA, VGS = 0V  
D = –250µA, referenced to 25°C  
–30  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
I
–22  
mVC  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
VDS = –24V, VGS = 0V  
VGS = ±25V, VDS = 0V  
–1  
µA  
µA  
±10  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = –250µA  
–1  
–2.2  
6
–3  
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
ID = –250µA, referenced to 25°C  
mV/°C  
V
GS = –10V, ID = –4.9A  
36  
58  
50  
15  
42  
75  
60  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = –4.5V, ID = –3.7A  
mΩ  
VGS = –10V, ID = –4.9A, TJ = 125°C  
VDD = –10V, ID = –4.9A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
755  
145  
125  
13  
1005  
195  
pF  
pF  
pF  
V
DS = –15V, VGS = 0V,  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
f = 1MHz  
190  
f = 1MHz  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
7
4
14  
10  
53  
37  
24  
13  
ns  
ns  
VDD = –15V, ID = –4.9A  
VGS = –10V, RGEN = 6Ω  
Turn-Off Delay Time  
Fall Time  
33  
23  
17  
9
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
VGS = 0V to –10V  
nC  
nC  
nC  
nC  
Qg  
VGS = 0V to –4.5V  
V
DD = –15V,  
ID = –4.9A  
Qgs  
Qgd  
2.9  
4.3  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
–1.3  
–1.2  
35  
A
V
VSD  
trr  
Source to Drain Diode Forward Voltage VGS = 0V, IS = –1.3A (Note 2)  
–0.8  
19  
9
Reverse Recovery Time  
IF = –4.9A, di/dt = 100A/µs  
Reverse Recovery Charge  
ns  
nC  
Qrr  
18  
Notes:  
2
1. R  
is determined with the device mounted on a 1in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R  
is guaranteed by design while R is determined by  
θCA  
θJA  
θJC  
the user's board design.  
a. 78°C/W when mounted on a  
1 in pad of 2 oz copper.  
b. 156°C/W when mounted on a  
minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.  
www.onsemi.com  
2
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