CSPEMI201AG
Mechanical Details
CSP Mechanical Specifications
The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Custom CSP
5
Package
Bumps
Millimeters
Min Nom Max
Inches
Nom
Dim
Min
Max
BOTTOM VIEW
A1
0.885 0.930 0.975 0.0348 0.0366 0.0384
1.365 1.410 1.455 0.0537 0.0555 0.0573
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.220 0.270 0.320 0.0087 0.0106 0.0126
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
SIDE
VIEW
C1
B2
B1
C
B
A
1
2 3
D1
D2
0.30 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI201AG Chip Scale Package
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
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