CSPEMI201AG
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
Solder Mask Opening
Solder Stencil Thickness
0.125mm - 0.150mm
0.300mm Round
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
50/50 by volume
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
60 seconds
260°C
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 7 of 9 | www.onsemi.com
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