ADT7460
ADDR
SELECT
ADDR_EN
SCL
SDA SMBALERT
SMBUS
ADDRESS
SELECTION
AUTOMATIC
FAN SPEED
CONTROL
SERIAL BUS
INTERFACE
ADDRESS
POINTER
REGISTER
PWM1
PWM2
PWM3
TACH1
TACH2
TACH3
TACH4
PWM REGISTERS
AND
CONTROLLERS
ACOUSTIC
ENHANCEMENT
CONTROL
DYNAMIC
T
MIN
CONTROL
FAN SPEED
COUNTER
PWM
CONFIGURATION
REGISTERS
INTERRUPT
MASKING
PERFORMANCE
MONITORING
THERM
V
CC
TO ADT7460
THERMAL
PROTECTION
V
CC
D1+
D1–
D2+
D2–
+2.5V
IN
ADT7460
INPUT
SIGNAL
CONDITIONING
AND
ANALOG
MULTIPLEXER
10−BIT
ADC
INTERRUPT
STATUS
REGISTERS
LIMIT
COMPARATORS
BAND GAP
TEMP SENSOR
GND
BAND GAP
REFERENCE
VALUE AND
LIMIT
REGISTERS
Figure 1. Functional Block Diagram
ABSOLUTE MAXIMUM RATINGS
Parameter
Positive Supply Voltage (V
CC
)
Voltage on Any Input or Output Pin
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
JMAX
)
Storage Temperature Range
Lead Temperature, Soldering
IR Reflow Peak Temperature
IR Reflow Peak Temperature for Pb−Free
Lead Temperature (Soldering, 10 sec)
Rating
6.5
−0.3 to +6.5
±5
±20
150
−65 to +150
220
260
300
Unit
V
V
mA
mA
°C
°C
°C
ESD Rating
1500
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Package Type
16−lead QSOP
q
JA
150
q
JC
39
Unit
°C/W
1.
q
JA
is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.
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