74HC244
PIN ASSIGNMENT
ENABLE A
A1
YB4
A2
YB3
A3
YB2
A4
YB1
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
ENABLE B
YA1
B4
YA2
B3
YA3
B2
YA4
B1
DATA
INPUTS
A4
B1
B2
B3
A2
A3
A1
2
4
6
8
11
13
15
17
LOGIC DIAGRAM
18
16
14
12
9
7
5
3
YA1
YA2
YA3
YA4
YB1
YB2
YB3
YB4
NONINVERTING
OUTPUTS
FUNCTION TABLE
Inputs
Enable A,
Enable B
A, B
Outputs
YA, YB
L
H
Z
B4
L
L
L
H
H
X
Z = high impedance
OUTPUT
ENABLES
1
ENABLE A
19
ENABLE B
PIN 20 = V
CC
PIN 10 = GND
ORDERING INFORMATION
Device
74HC244DTR2G
Package
TSSOP−20*
Shipping
†
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS
Symbol
V
CC
V
in
V
out
I
in
I
out
I
CC
P
D
T
stg
T
L
Parameter
Value
Unit
V
V
V
mA
mA
mA
mW
_C
_C
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, V
CC
and GND Pins
Power Dissipation in Still Air, TSSOP Package†
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(TSSOP Package)
– 0.5 to + 7.0
– 0.5 to V
CC
+ 0.5
– 0.5 to V
CC
+ 0.5
±20
±35
±75
450
– 65 to + 150
260
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND
v
(V
in
or V
out
)
v
V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — TSSOP Package:
−
6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
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