¡ Semiconductor
MSM7702-01/02/03
RECOMMENDATIONS FOR ACTUAL DESIGN
• Toassureproperelectricalcharacteristics,usebypasscapacitorswithexcellenthighfrequency
characteristics for the power supply and keep them as close as possible to the device pins.
• Connect the AG pin and the DG pin each other as close as possible. Connect to the system
ground with low impedance.
• Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If an
IC socket is unavoidable, use the short lead type socket.
• When mounted on a frame, use electro-magnetic shielding, if any electro-magnetic wave
source such as power supply transformers surround the device.
• Keep the voltage on the V pin not lower than –0.3 V even instantaneously to avoid latch-
DD
up phenomenon when turning the power on.
• Use a low noise (particularly, low level type of high frequency spike noise or pulse noise)
powersupplytoavoiderroneousoperationandthedegradationofthecharacteristicsofthese
devices.
15/17
OKI [ OKI ELECTRONIC COMPONETS ]
