PEDL66517-03
1
Semiconductor
ML66517 Family
(Unit : mm)
QFP64-P-1414-0.80-BK
MIRROR FINISH
Package material
Lead frame material
Pin treatment
Epoxy resin
42 alloy
Solder plating
5 m or more
0.87 TYP.
Solder plate thickness
Package weight (g)
Notes for Mounting the Surface Mount Type Packages
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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OKI [ OKI ELECTRONIC COMPONETS ]
