TDF8544
NXP Semiconductors
I2C-bus controlled 4 50 W power amplifier
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height
SOT851-1
D
E
A
x
c
y
X
E
2
H
E
v
A
D
1
D
2
1
18
pin 1 index
Q
A
A
2
E
1
(A )
3
A
4
θ
L
p
detail X
36
19
z
w
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(2)
UNIT
mm
A
A
A
b
c
D
D
D
E
E
1
E
e
H
L
p
Q
v
w
x
y
Z
θ
2
3
4
p
1
2
2
E
max.
+0.08 0.38 0.32
−0.04 0.25 0.23
3.4
3.3
16.0 13.0 1.1 11.1 6.2 2.9
15.8 12.6 0.9 10.9 5.8 2.5
14.5 1.1 1.7
13.9 0.8 1.5
2.55
2.20
8°
0°
0.65
3.5
0.35
0.25 0.12 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
04-03-09
04-05-25
SOT851-1
Fig 39. Package outline SOT851-1 (HSOP36)
TDF8544
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 August 2011
50 of 54
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