TDF8544
NXP Semiconductors
I2C-bus controlled 4 50 W power amplifier
15. Package outline
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm)
SOT827-1
non-concave
D
h
x
D
E
h
view B: mounting base side
A
2
d
B
j
E
A
L
4
L
3
L
L
2
1
27
e
w
M
Z
1
c
v
M
Q
b
p
e
e
2
m
0
10
scale
20 mm
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
L
L
4
m
Q
v
w
x
Z
2
p
h
1
2
h
2
3
4.65 0.60 0.5 29.2 25.8
4.35 0.45 0.3 28.8 25.4
15.9
15.5
3.4
3.1
3.9 1.15 22.9
3.1 0.85 22.1
1.8
1.2
2.1
1.8
8
6.8
mm
12
2
1
4
19
4
0.6 0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-07-29
SOT827-1
- - -
- - -
- - -
Fig 37. Package outline SOT827-1 (DBS27P)
TDF8544
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 August 2011
48 of 54
NXP [ NXP ]
