TDF8544
NXP Semiconductors
I2C-bus controlled 4 50 W power amplifier
RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm)
SOT878-1
non-concave
D
h
x
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
1
27
c
e
2
e
1
Z
Q
M
v
M
e
w
0
L
1
b
p
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
Z
UNIT
A
A
2
b
c
D
d
D
E
e
e
e
E
j
L
L
1
Q
v
w
x
p
h
1
2
h
4.65 0.60 0.5 29.2 25.8
4.35 0.45 0.3 28.8 25.4
15.9
15.5
3.4 3.75 3.75 2.1
3.1 3.15 3.15 1.8
1.8
1.2
12
mm 13.5
2
1
2.54
8
0.6 0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
05-01-11
05-01-26
SOT878-1
Fig 38. Package outline SOT878-1 (RDBS27P)
TDF8544
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 August 2011
49 of 54
NXP [ NXP ]
