TDA8950
NXP Semiconductors
2 × 150 W class-D power amplifier
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 31. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Revision history
Table 13. Revision history
Document ID
Release date
20080909
Data sheet status
Change notice
Supersedes
TDA8950_1
Preliminary data sheet
-
-
TDA8950_1
© NXP B.V. 2008. All rights reserved.
Preliminary data sheet
Rev. 01 — 9 September 2008
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