TDA8950
NXP Semiconductors
2 × 150 W class-D power amplifier
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
12
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
24
13
w
M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.7
2.2
3.5
3.2
mm
1
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-02-18
03-07-23
SOT566-3
Fig 30. Package outline SOT566-3 (HSOP24)
TDA8950_1
© NXP B.V. 2008. All rights reserved.
Preliminary data sheet
Rev. 01 — 9 September 2008
34 of 39
NXP [ NXP ]
