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TDA8920CTH 参数 Datasheet PDF下载

TDA8920CTH图片预览
型号: TDA8920CTH
PDF下载: 下载PDF文件 查看货源
内容描述: 2 “ 110瓦特的D类功率放大器 [2 ´ 110 W class-D power amplifier]
分类和应用: 消费电路商用集成电路音频放大器视频放大器功率放大器光电二极管
文件页数/大小: 39 页 / 232 K
品牌: NXP [ NXP ]
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TDA8920C  
NXP Semiconductors  
2 × 110 W class-D power amplifier  
8.2 Pulse-width modulation frequency  
The amplifier output signal is a PWM signal with a typical carrier frequency of between  
250 kHz and 450 kHz. A 2nd-order LC demodulation filter on the output is used to convert  
the PWM signal into an analog audio signal. The carrier frequency is determined by an  
external resistor, ROSC, connected between pins OSC and VSSA. The optimal carrier  
frequency setting is between 250 kHz and 450 kHz.  
The carrier frequency is set to 345 kHz by connecting an external 30 kresistor between  
pins OSC and VSSA. See Table 9 on page 14 for more details.  
If two or more class-D amplifiers are used in the same audio application, it is  
recommended that an external clock circuit be used with all devices (see Section 13.4).  
This will ensure that they operate at the same switching frequency, thus avoiding beat  
tones (if the switching frequencies are different, audible interference known as ‘beat tones’  
can be generated)  
8.3 Protection  
The following protection circuits are incorporated into the TDA8920C:  
Thermal protection:  
Thermal FoldBack (TFB)  
OverTemperature Protection (OTP)  
OverCurrent Protection (OCP)  
Window Protection (WP)  
Supply voltage protection:  
UnderVoltage Protection (UVP)  
OverVoltage Protection (OVP)  
UnBalance Protection (UBP)  
How the device reacts to a fault conditions depends on which protection circuit has been  
activated.  
8.3.1 Thermal protection  
The TDA8920C employes an advanced thermal protection strategy. A TFB function  
gradually reduces the output power within a defined temperature range. If the temperature  
continues to rise, OTP is activated to shut down the device completely.  
8.3.1.1 Thermal FoldBack (TFB)  
If the junction temperature (Tj) exceeds the thermal foldback activation threshold, the gain  
is gradually reduced. This reduces the output signal amplitude and the power dissipation,  
eventually stabilizing the temperature.  
TFB is specified at the thermal foldback activation temperature Tact(th_fold) where the  
closed-loop voltage gain is reduced by 6 dB. The TFB range is:  
T
act(th_fold) 5 °C < Tact(th_fold) < Tact(th_prot)  
The value of Tact(th_fold) for the TDA8920C is approximately 153 °C; see Table 8 for more  
details.  
TDA8920C_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 11 June 2009  
8 of 39  
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