TDA8920C
NXP Semiconductors
2 × 110 W class-D power amplifier
14. Package outline
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
SOT411-1
non-concave
D
h
x
D
E
h
view B: mounting base side
A
2
d
A
A
5
4
β
E
2
B
j
E
E
1
L
2
L
L
3
1
L
c
2
Q
v M
1
23
e
m
e
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT A
A
A
b
c
D
d
D
E
e
e
e
E
E
E
j
L
L
L
L
3
m
Q
v
w
x
β
Z
2
4
5
p
h
1
2
h
1
2
1
2
4.6 1.15 1.65 0.75 0.55 30.4 28.0
4.3 0.85 1.35 0.60 0.35 29.9 27.5
12.2
11.8
10.15 6.2 1.85 3.6 14 10.7 2.4
9.85 5.8 1.65 2.8 13 9.9 1.6
1.43
0.78
2.1
1.8
6
mm
12
2.54 1.27 5.08
4.3
0.6 0.25 0.03 45°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
98-02-20
02-04-24
SOT411-1
Fig 28. Package outline SOT411-1 (DBS23P)
TDA8920C_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 11 June 2009
32 of 39
NXP [ NXP ]
