Philips Semiconductors
Product specification
Economy Autosync Deflection Controller
(EASDC)
TDA4858
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
V
CC
V
I(n)
supply voltage
input voltages
BIN
HSYNC, VPOS, VAMP, VSCOR, VREF, HREF and HPOS
XRAY
CLSEL
V
O(n)
output voltages
VOUT1 and VOUT2
BDRV and HDRV
V
I/O(n)
input/output voltages
BOP and BSENS
VSYNC
I
HDRV
I
HFLB
I
CLBL
I
BOP
I
BDRV
I
EWDRV
T
amb
T
j
T
stg
V
esd
horizontal driver output current
horizontal flyback input current
video clamping pulse/vertical blanking output current
B+ control OTA output current
B+ control driver output current
EW driver output current
operating ambient temperature
junction temperature
storage temperature
electrostatic discharge for all pins (note 1)
machine model
human body model
Note
1. Machine model: 200 pF, 25
Ω,
2.5
µH;
human body model: 100 pF, 1500
Ω,
7.5
µH.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
PARAMETER
thermal resistance from junction to ambient in free air
VALUE
55
UNIT
K/W
−400
−3000
+400
+3000
V
V
−0.5
−0.5
−
−10
−
−
−
−
0
−
−55
+6.0
+6.5
100
+10
−10
1
50
−5
70
150
+150
V
V
mA
mA
mA
mA
mA
mA
°C
°C
°C
−0.5
−0.5
+6.5
+16
V
V
−0.5
−0.5
−0.5
−0.5
+6.0
+6.5
+8.0
+16
V
V
V
V
PARAMETER
MIN.
−0.5
MAX.
+16
V
UNIT
QUALITY SPECIFICATION
In accordance with
“URF-4-2-59/601”;
EMC emission/immunity test in accordance with
“DIS 1000 4.6”
(IEC 801.6)
SYMBOL
V
EMC
PARAMETER
emission test
immunity test
CONDITIONS
note 1
note 1
−
−
MIN.
TYP.
1.5
2.0
−
−
MAX.
UNIT
mV
V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1997 Oct 27
12
PHILIPS [ NXP SEMICONDUCTORS ]
