NXP Semiconductors
PCA9555
16-bit I
2
C-bus and SMBus I/O port with interrupt
5.2 Pin description
Table 3.
Symbol
Pin description
Pin
DIP24, SO24,
SSOP24, TSSOP24
INT
A1
A2
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
V
SS
IO1_0
IO1_1
IO1_2
IO1_3
IO1_4
IO1_5
IO1_6
IO1_7
A0
SCL
SDA
V
DD
[1]
Description
HVQFN24,
HWQFN24
22
23
24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
address input 0
serial clock line
serial data line
supply voltage
supply ground
port 1 input/output
interrupt output (open-drain)
address input 1
address input 2
port 0 input/output
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
HVQFN and HWQFN package die supply ground is connected to both the V
SS
pin and the exposed center
pad. The V
SS
pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
5 of 34
PHILIPS [ NXP SEMICONDUCTORS ]
