NXP Semiconductors
FXPS7115D4
Digital absolute pressure sensor, 40 kPa to 115 kPa
14 Application information
The FXPS7115D4 sensor can operate in two modes: I2C and SPI. The application
diagrams in Figure 25 and Figure 26 show the modes and their respective biasing and
bypass components.
The sensor can be configured to operate in SPI mode to read the user registers, self-test
and diagnostics information. The application diagram in Figure 26 shows the SPI and the
respective biasing and bypass components.
Note: A gel is used to provide media protection against corrosive elements which
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas
molecules may permeate through the gel and then occupy boundaries between material
surfaces within the sensor package. When decompression occurs, the gas molecules
may collect, form bubbles and possibly result in delamination of the gel from the material
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,
the sensor measurement may shift from its calibrated transfer function. In some cases,
these temporary shifts could be outside the tolerances listed in the data sheet. In rare
cases, the bubble may bend the bond wires and result in a permanent shift.
V
V
CC
V
CC
CC
V
CC
R1
R2
R3
V
SS
CCIO
INT
FXPS7xxxD4
SCL
C1
V
SDA
SS
aaa-029732
Figure 25.ꢀI2C application diagram of FXPS7115D4
Table 103.ꢀExternal component recommendations for I2C
Name
Type
Description
Purpose
C1
Ceramic
0.1 μF, 10 %, 10 V minimum, X7R
1000 Ω, 5 %, 200 PPM
1000 Ω, 5 %, 200 PPM
1000 Ω, 5 %, 200 PPM
VCC power supply decoupling
I2C selection pin pull-up resistor
Serial clock pull-up resistor
Serial data pull-up resistor
R1
General purpose
General purpose
General purpose
R2
R3
FXPS7115D4
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© NXP B.V. 2019. All rights reserved.
Product data sheet
Rev. 3 — 5 December 2019
60 / 72
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