NXP Semiconductors
Product data sheet
18-fold ESD transient voltage suppressor
PACKAGE OUTLINE
BZA100
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
1
pin 1 index
L
p
L
1
e
b
p
10
w
M
detail X
(A
3
)
θ
A
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
2.65
0.1
A
1
0.3
0.1
A
2
2.45
2.25
A
3
0.25
0.01
b
p
0.49
0.36
c
0.32
0.23
D
(1)
13.0
12.6
0.51
0.49
E
(1)
7.6
7.4
0.30
0.29
e
1.27
0.05
H
E
10.65
10.00
L
1.4
L
p
1.1
0.4
Q
1.1
1.0
0.043
0.039
v
0.25
0.01
w
0.25
0.01
y
0.1
0.004
Z
(1)
θ
o
0.9
0.4
0.035
0.016
0.012 0.096
0.004 0.089
0.019 0.013
0.014 0.009
0.419
0.043
0.055
0.394
0.016
8
0
o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT163-1
REFERENCES
IEC
075E04
JEDEC
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
1997 Dec 02
5
PHILIPS [ NXP SEMICONDUCTORS ]
