Package mechanical
NAND01G-B2B, NAND02G-B2C
Figure 36. VFBGA63 9.5 x 12 mm - 6 x 8 active ball array, 0.80 mm pitch, package outline
D
D2
D1
FD1
SD
FD
e
e
SE
E
E2 E1
ddd
BALL "A1"
FE1
FE
e
b
A
A2
A1
BGA-Z67
1. Drawing is not to scale
Table 27. VFBGA63 9.5 x 12 mm - 6 x 8 ball array, 0.80 mm pitch, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
1.05
0.041
0.25
0.010
0.70
0.50
9.60
0.028
0.020
0.378
0.45
9.50
4.00
7.20
0.40
9.40
0.018
0.374
0.157
0.283
0.016
0.370
D
D1
D2
ddd
E
0.10
0.004
0.476
12.00
5.60
8.80
0.80
2.75
1.15
3.20
1.60
0.40
0.40
11.90
–
12.10
0.472
0.220
0.346
0.031
0.108
0.045
0.126
0.063
0.016
0.016
0.468
–
E1
E2
e
–
–
FD
FD1
FE
FE1
SD
SE
56/60