Package mechanical
M58LT256JST, M58LT256JSB
13
Package mechanical
To meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 18. TBGA64 10 × 13 mm - 8 x 8 active ball array, 1 mm pitch, bottom view
package outline
D
D1
FD
FE
SD
SE
E
E1
ddd
BALL "A1"
A
e
b
A2
A1
BGA-Z23
1. Drawing is not to scale.
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