Package mechanical
M58LT128HST, M58LT128HSB
13
Package mechanical
To meet environmental requirements, Numonyx offers the M58LT128HST and
M58LT128HSB devices in ECOPACK® packages that have a lead-free, second-level
interconnect. The category of second-level interconnect is marked on the package and on
the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 18. TBGA64 10 × 13 mm - 8 × 8 active ball array, 1 mm pitch, bottom view
package outline
D
D1
FD
FE
SD
SE
E
E1
ddd
BALL "A1"
A
e
b
A2
A1
BGA-Z23
1. Drawing is not to scale.
70/110