28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Figure 9.
x16 48-Ball VF BGA and µBGA* Chip Size Package (Top View, Ball Down)
1
2
3
4
5
6
7
8
16M
A
B
C
D
E
F
A13
A11
A8
VPP
WP#
A19
A7
A4
A14
A15
A16
VCCQ
Vss
A10
A12
D14
D15
D7
WE#
A9
RP#
A21
D11
D12
D4
A18
A20
D2
A17
A6
A5
A3
A2
A1
64M
32M
D5
D8
CE#
D0
A0
D6
D3
D9
Vss
OE#
D13
VCC
D10
D1
Notes:
1.
A19, A20, and A21 indicate the upgrade address connections. Lower density devices do not have the
upper address solder balls. Do not route in this area.
– A19 is the upgrade address for the 16-Mbit device.
– A20 is the upgrade address for the 32-Mbit device.
– A21 is the upgrade address for the 64-Mbit device.
2.
Table 10 “B3 Flash memory Device Signal Descriptions” on page 31 details the usage of each device
pin.
5.2
Signal Descriptions
Table 10 describes the active signals.
18 Aug 2005
30
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
Datasheet
NUMONYX [ NUMONYX B.V ]
