28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
5.0
Pinout and Signal Descriptions
This section explains the package pinout and signal descriptions.
5.1
Signal Pinouts
The B3 flash memory device is available in the following packages:
• 40-lead TSOP (x8, Figure 5).
• 48-lead TSOP (x16, Figure 6).
• 48-ball µBGA (x8 in Figure 8 and x16 in Figure 9).
• 48-ball VF BGA (x16, Figure 9).
5.1.1
40-Lead and 48-Lead TSOP Packages
Figure 5.
40-Lead TSOP Package for x8 Configurations
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
A17
GND
A20
A19
A10
16 M
8 M
DQ7
DQ6
DQ5
DQ4
VCCQ
VCC
NC
DQ3
DQ2
DQ1
DQ0
OE#
GND
CE#
A0
A8
Advanced Boot Block
40-Lead TSOP
10 mm x 20 mm
WE#
RP#
VPP
WP#
A18
A7
A6
A5
A4
A3
TOP VIEW
4 M
A2
A1
Notes:
1.
2.
40-Lead TSOP available for 8-Mbit and 16-Mbit densities only.
Lower densities have NC on the upper address pins. For example, an 8-Mbit device has NC on Pin 38.
Datasheet
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
18 Aug 2005
27
NUMONYX [ NUMONYX B.V ]
