28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
4.2
TSOP Package
Figure 3.
TSOP Package Drawing
Z
A
2
See Notes 1, 2, 3 and 4
Pin 1
e
See Detail B
E
Y
D
1
A
1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
b
0
L
A5568-02
Dimensions
Family: Thin Small Ou-Lt ine Package
Symbol
Millimeters
Nom
Inches
Nom
Min
Max
1.200
Notes
Min
Max
Notes
Package Height
Standoff
A
A1
A2
b
0.047
0.050
0.002
Package Body Thickness
Lead Width
0.950 1.000 1.050
0.150 0.200 0.300
0.037 0.039 0.041
0.006 0.008 0.012
Lead Thickness
Plastic Body Length
Package Body Width
Lead Pitch
c
D1
E
0.100 0.150 0.200
18.200 18.400 18.600
11.800 12.000 12.200
0.500
0.004 0.006 0.008
0.717 0.724 0.732
0.465 0.472 0.480
0.0197
e
Terminal Dimension
Lead Tip Length
D
L
19.800 20.000 20.200
0.500 0.600 0.700
48
0.780 0.787 0.795
0.020 0.024 0.028
48
Lead Count
N
Ø
Y
Lead Tip Angle
0°
3°
5°
0°
3°
5°
Seating Plane Coplanarity
Lead to Package Offset
0.100
0.004
Z
0.150 0.250 0.350
0.006 0.010 0.014
Notes:
1.
2.
3.
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 is in the upper left corner of the package, in reference to the product mark.
Datasheet
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
18 Aug 2005
25
NUMONYX [ NUMONYX B.V ]
