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LM3485MM/NOPB 参数 Datasheet PDF下载

LM3485MM/NOPB图片预览
型号: LM3485MM/NOPB
PDF下载: 下载PDF文件 查看货源
内容描述: [IC SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO8, PLASTIC, MSOP-8, Switching Regulator or Controller]
分类和应用: 开关光电二极管
文件页数/大小: 16 页 / 375 K
品牌: NSC [ National Semiconductor ]
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The off state voltage across the catch diode is approximately  
equal to the input voltage. The peak reverse voltage rating  
must be greater than input voltage. In nearly all cases a  
Schottky diode is recommended. In low output voltage appli-  
cations a low forward voltage provides improved efficiency.  
For high temperature applications, diode leakage current may  
become significant and require a higher reverse voltage rating  
to achieve acceptable performance.  
higher than the 25°C value. This increase in RDSON must be  
considered it when determining RADJ in wide temperature  
range applications. If the current limit is set based upon 25°C  
ratings, then false current limiting can occur at high temper-  
ature.  
Keeping the gate capacitance below 2000pF is recommend-  
ed to keep switching losses and transition times low. This will  
also help keep the PFET drive current low, which will improve  
efficiency and lower the power dissipation within the con-  
troller.  
P-CHANNEL MOSFET SELECTION (Q1)  
The important parameters for the PFET are the maximum  
Drain-Source voltage (VDS), the on resistance (RDSON), Cur-  
rent rating, and the input capacitance.  
As gate capacitance increases, operating frequency should  
be reduced and as gate capacitance decreases operating  
frequency can be increased.  
The voltage across the PFET when it is turned off is equal to  
the sum of the input voltage and the diode forward voltage.  
The VDS must be selected to provide some margin beyond the  
input voltage.  
PCB Layout  
The PC board layout is very important in all switching regu-  
lator designs. Poor layout can cause switching noise into the  
feedback signal and general EMI problems. For minimal in-  
ductance, the wires indicated by heavy lines should be as  
wide and short as possible. Keep the ground pin of the input  
capacitor as close as possible to the anode of the diode. This  
path carries a large AC current. The switching node, the node  
with the diode cathode, inductor, and FET drain, should be  
kept short. This node is one of the main sources for radiated  
EMI since it is an AC voltage at the switching frequency. It is  
always good practice to use a ground plane in the design,  
particularly at high currents.  
PFET drain current, Id, must be rated higher than the peak  
inductor current, IIND-PEAK  
.
Depending on operating conditions, the PGATE voltage may  
fall as low as VIN - 8.3V. Therefore, a PFET must be selected  
with a VGS greater than the maximum PGATE swing voltage.  
As input voltage desreases below 9V, PGATE swing voltage  
may also decrease. At 5.0V input the PGATE will swing from  
VIN to VIN - 4.6V. To ensure that the PFET turns on quickly  
and completely, a low threshold PFET should be used when  
the input voltage is less than 7V.  
However, PFET switching losses will increase as the VGS  
threshold decreases. Therefore, whenever possible, a high  
threshold PFET should be selected. Total power loss in the  
FET can be approximated using the following equation:  
The two ground pins, PWR GND and GND, should be con-  
nected by as short a trace as possible; they can be connected  
underneath the device. These pins are resistively connected  
internally by approximately 50. The ground pins should be  
tied to the ground plane, or to a large ground trace in close  
proximity to both the FB divider and COUT grounds.  
PDswitch = RDSON*IOUT2*D + F*IOUT*VIN*(ton + toff)/2  
where:  
The gate pin of the external PFET should be located close to  
the PGATE pin. However, if a very small FET is used, a re-  
sistor may be required between PGATE and the gate of the  
FET to reduce high frequency ringing. Since this resistor will  
slow the PFET's rise time, the current limit blanking time  
should be taken into consideration (see Current Limit Opera-  
tion).  
ton = FET turn on time  
toff = FET turn off time  
A value of 10ns to 20ns is typical for ton and toff.  
A PFET should be selected with a turn on rise time of less  
than 100ns. Slower rise times will degrade efficiency, can  
cause false current limiting, and in extreme cases may cause  
abnormal spiking at the PGATE pin.  
The feedback voltage signal line can be sensitive to noise.  
Avoid inductive coupling to the inductor or the switching node,  
by keeping the FB trace away from these areas.  
The RDSON is used in determining the current limit resistor  
value, RADJ. Note that the RDSON has a positive temperature  
coefficient. At 100°C, the RDSON may be as much as 150%  
www.national.com  
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