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30141-23 参数 Datasheet PDF下载

30141-23图片预览
型号: 30141-23
PDF下载: 下载PDF文件 查看货源
内容描述: 的Geode ™ GXM处理器与MMX支持集成的x86解决方案 [Geode⑩ GXm Processor Integrated x86 Solution with MMX Support]
分类和应用: 微控制器和处理器外围集成电路微处理器
文件页数/大小: 244 页 / 4221 K
品牌: NSC [ National Semiconductor ]
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Package Specifications (Continued)  
Table 8-3. Mechanical Package Outline Legend  
Symbol  
Meaning  
A
A1  
A2  
aaa  
B
Distance from seating plane datum to highest point of body  
Solder ball height  
Laminate thickness (excluding heat spreader)  
Coplanarity  
Pin or solder ball diameter  
D
Largest overall package outline dimension  
Length from outer pin center to outer pin center  
Heat spreader outline dimension  
D1  
D2  
E1  
BGA: Solder ball pitch  
SPGA: Linear spacing between true pin position centerlines  
E2  
F
Diagonal spacing between true pin position centerlines  
Flatness  
L
Distance from seating plane to tip of pin  
Length from outer pin/ball center to edge of laminate  
S1  
www.national.com  
200  
Revision 3.1